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ACKNOWLEDGMENT: Move2THz is supported by the Chips Joint Undertaking and its members, including the top-up funding by National Authorities under Grant Agreement n° 101139842.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or the granting authority. Neither the European Union nor the granting authority can be held responsible for them.
Photos © Christophe LEPETIT
8 Move2THz-related PUBLICATIONS in the OPEN ACCESS PDF BOOK - the outcome from EuMW Week 2024 (Paris) workshop “Key Enabling Technologies for Future Wireless, Wired, Optical and Satcom Applications”. This book presents the latest research roadmaps and achievements from the European ecosystem (industry, research, and academia) driving the development of future wireless, wired, optical and satcom applications utilizing the mm-wave and sub-THz bands. It covers the entire value chain, including technologies, devices, characterization, architectures, circuits, 3D heterogeneous integration and packaging.
Find topics such as:
- "B55X: A SHIFT in STMicroelectronics BiCMOS Technologies"
- "Advanced Substrate Technologies for Sub-THz Era"
- "RF Technology Roadmap for 5G and 6G RF Front-end Systems"
- "A CMOS Compatible III-V-on-300 mm Si Technology for Future High-speed Communication Systems: Challenges and Possibilities"
- "Challenges for 2.5D and 3D Integration of InP HBT Technology"
- ...
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Scientific
Papers
8 Move2THz-related PUBLICATIONS in the OPEN ACCESS PDF BOOK - the outcome from EuMW Week 2024 (Paris) workshop “Key Enabling Technologies for Future Wireless, Wired, Optical and Satcom Applications”. This book presents the latest research roadmaps and achievements from the European ecosystem (industry, research, and academia) driving the development of future wireless, wired, optical and satcom applications utilizing the mm-wave and sub-THz bands. It covers the entire value chain, including technologies, devices, characterization, architectures, circuits, 3D heterogeneous integration and packaging.
Find topics such as:
- "B55X: A SHIFT in STMicroelectronics BiCMOS Technologies"
- "Advanced Substrate Technologiesfor Sub-THz Era"
- "RF Technology Roadmap for 5G and 6G RF Front-end Systems"
- "A CMOS Compatible III-V-on-300 mm Si Technology for Future High-speed Communication Systems: Challenges and Possibilities"
- and other.
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