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ACKNOWLEDGMENT: Move2THz is supported by the Chips Joint Undertaking and its members, including the top-up funding by National Authorities under Grant Agreement n° 101139842.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or the granting authority. Neither the European Union nor the granting authority can be held responsible for them.
Photos © Christophe LEPETIT
About
Main mission, vision and goals
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Sustainable wireless applications
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Revolutionary InP-on-silicon innovation
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Time to market
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Autonomy of European InP sector
Mature European Ecosystem
MISSION
Move2THz will address today’s InP shortcomings and build a mature European ecosystem to obtain a commercially and industry viable platform for use in various mass-market applications utilizing the higher frequency spectrum towards THz and beyond.
THz-Ready Europe
VISION
MISSION
Mature European Ecosystem
-
Autonomy of European InP sector
-
Time to market
-
Revolutionary InP-on-silicon innovation
-
Sustainable wireless applications
Move2THz will address today’s InP shortcomings and build a mature European ecosystem to obtain a commercially and industry viable platform for use in various mass-market applications utilizing the higher frequency spectrum towards THz and beyond.
THz-Ready Europe
VISION
THE PURPOSE BEHIND
Main objectives
C02
High volume InP manufacturing in Europe
Provide a competitive facility for the high volume InP manufacturing in Europe, ready to use for industry;
Move2THz will radically innovate the manufacturing process by establishing a breakthrough InP-on-silicon (InPoSi) global standard.
Objectives in detail
THE PURPOSE BEHIND
The main purpose behind
Main objectives
Objectives in detail
C02
High volume InP manufacturing in Europe
Provide a competitive facility for the high volume InP manufacturing in Europe, ready to use for industry;
Move2THz will radically innovate the manufacturing process by establishing a breakthrough InP-on-silicon (InPoSi) global standard.
The 6G communication and network will require higher data rate and the sub-THz technologies, ramping up by the year 2030. This is the market window for the InP ecosystem to show its maturity and an acceptable PPAC (Performance, Power, Area, Cost). By the year 2027, Move2THz should be able to provide competitive elements for the technology selection.
Move2THz is breaking the frequency wall to enable industry-viable next-generation applications by providing a sustainable technology platform & related ecosystem covering the entire value chain.
Why do we need this technology upgrade? Electronic devices have evolved significantly, fuelling the digital transformation towards a connected society. The growing need for performance, speed, and efficiency pushes wireless applications to operate at sub-THz frequencies and beyond. A disruptive yet commercially viable technology is urgently needed. Project will radically innovate the manufacturing process by establishing a breakthrough InPoSi global standard. This facilitates to upscale the 𝗪𝗔𝗙𝗘𝗥 𝗦𝗜𝗭𝗘 & volume compatible with CMOS manufacturing capacities, while minimizing the use of rare InP resources and ecological footprint.
Breaking Frequency Barriers for Next-Gen Applications
Technology value: greener, affordable, closer to silicon for a wider market adoption.
Breaking Frequency Barriers for Next-Gen Applications
Technology value: greener, affordable, closer to silicon for a wider market adoption.
Move2THz is breaking the frequency wall to enable industry-viable next-generation applications by providing a sustainable technology platform & related ecosystem covering the entire value chain.
Why do we need this technology upgrade? Electronic devices have evolved significantly, fuelling the digital transformation towards a connected society. The growing need for performance, speed, and efficiency pushes wireless applications to operate at sub-THz frequencies and beyond. A disruptive yet commercially viable technology is urgently needed. Project will radically innovate the manufacturing process by establishing a breakthrough InPoSi global standard. This facilitates to upscale the 𝗪𝗔𝗙𝗘𝗥 𝗦𝗜𝗭𝗘 & volume compatible with CMOS manufacturing capacities, while minimizing the use of rare InP resources and ecological footprint.
About
Main mission, vision and goals
