Move2THz
Sustainable INDIUM PHOSPHIDE (InP) platform and ecosystem upscaling, enabling future mass market (sub-)THz applications.
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Sustainable wireless applications
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Revolutionary InP-on-silicon innovation
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Time to market
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Autonomy of European InP sector
Mature European Ecosystem
MISSION
Sustainable INDIUM PHOSPHIDE (InP) platform and ecosystem upscaling, enabling future mass market (sub-)THz applications.
Move2THz
Mature European Ecosystem
-
Autonomy of European InP sector
-
Time to market
-
Revolutionary InP-on-silicon innovation
-
Sustainable wireless applications
MISSION
Move2THz will address today’s InP shortcomings and build a mature European ecosystem to obtain a commercially and industry viable platform for use in various mass-market applications utilizing the higher frequency spectrum towards THz and beyond.
THz-Ready Europe
VISION
THz-Ready Europe
Move2THz will address today’s InP shortcomings and build a mature European ecosystem to obtain a commercially and industry viable platform for use in various mass-market applications utilizing the higher frequency spectrum towards THz and beyond.
VISION
The Main Purpose Behind
C02
High volume InP manufacturing in Europe
Project aims to provide a competitive facility for the high volume InP manufacturing in Europe, ready to use for industry.
MAIN GOALS
Breaking Frequency Barriers for Next-Gen Applications
Project will radically innovate the manufacturing process by establishing a breakthrough InP-on-silicon (InPoSi) global standard. This facilitates to upscale the 𝗪𝗔𝗙𝗘𝗥 𝗦𝗜𝗭𝗘 & volume compatible with CMOS manufacturing capacities, while minimizing the use of rare InP resources and ecological footprint.
MAIN GOALS
The Main Purpose Behind
C02
High volume InP manufacturing in Europe
Provide a competitive facility for the high volume InP manufacturing in Europe, ready to use for industry.
Breaking Frequency Barriers for Next-Gen Applications
Project will radically innovate the manufacturing process by establishing a breakthrough InP-on-silicon (InPoSi) global standard. This facilitates to upscale the 𝗪𝗔𝗙𝗘𝗥 𝗦𝗜𝗭𝗘 & volume compatible with CMOS manufacturing capacities, while minimizing the use of rare InP resources and ecological footprint.
Key facts
Start date
2024 06 01
Total investment
€ 40,67 M
EU budget contribution
€ 11,96 M
Duration
36 months
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Total investment
EU budget contribution
Start date
Duration
€ 40,67 M
€ 11,96 M
2024 06 01
36 months
Key facts
Contact us