On September 8th, the clustering workshop “Shaping the Future through Innovations in RF & Mm-Wave Design and Technology” took place at the European Solid-State Electronics Research Conference - ESSERC 2025.

It was jointly organized by Fraunhofer, CEA-Leti, and imec, and driven by major industrial partners. The workshop focuses on RF and mm-wave sensing and communication technologies, dedicated to selected project outcomes of Chips Joint Undertaking projects: SOIL EU project, BEYOND5, and Move2THz.

The Workshop Chairs:

Erkan Isa (Fraunhofer, DE),
Dominique Morche (CEA-Leti, FR),
and Björn Debaillie (imec, BE).

The Workshop Speakers:

Dr. Abhitosh Vais (imec),
Baudouin Martineau (CEA-Leti),
Dr. Fredrik Tillman (Ericsson),
Dr. -Ing. Arndt Ott (Sony),
Prof. Thomas Kämpfe (Fraunhofer),
Dr. Yvan Morandini (Soitec),
Prof. Hua Wang (ETH Zürich),
and Tobias Van Rey (IMST).

It was a truly inspiring day filled with knowledge-sharing, collaboration, and fresh perspectives. Here you see the event organisers and speakers smiling after a successful and energising session.

A big thank you to everyone who contributed to making this workshop such a success — your engagement and enthusiasm made all the difference!

The full workshop programme and participant profiles can be found here: https://www.esserc2025.org/w6

About the conference in general: The aim of ESSERC is to provide an annual European forum for the presentation and discussion of recent advances in solid-state devices and circuits. The level of integration for system-on-chip design is rapidly increasing. This is made available by advances in semiconductor technology. Therefore, more than ever before, a deeper interaction among technologists, device experts, IC designers and system designers is necessary.

𝘔𝘰𝘷𝘦2𝘛𝘏𝘻 𝘱𝘳𝘰𝘫𝘦𝘤𝘵 𝘪𝘴 𝘴𝘶𝘱𝘱𝘰𝘳𝘵𝘦𝘥 𝘣𝘺 𝘵𝘩𝘦 𝘊𝘩𝘪𝘱𝘴 𝘑𝘰𝘪𝘯𝘵 𝘜𝘯𝘥𝘦𝘳𝘵𝘢𝘬𝘪𝘯𝘨 𝘢𝘯𝘥 𝘪𝘵𝘴 𝘮𝘦𝘮𝘣𝘦𝘳𝘴, 𝘪𝘯𝘤𝘭𝘶𝘥𝘪𝘯𝘨 𝘵𝘩𝘦 𝘵𝘰𝘱-𝘶𝘱 𝘧𝘶𝘯𝘥𝘪𝘯𝘨 𝘣𝘺 𝘕𝘢𝘵𝘪𝘰𝘯𝘢𝘭 𝘈𝘶𝘵𝘩𝘰𝘳𝘪𝘵𝘪𝘦𝘴 𝘰𝘧 𝘍𝘳𝘢𝘯𝘤𝘦, 𝘚𝘸𝘪𝘵𝘻𝘦𝘳𝘭𝘢𝘯𝘥, 𝘎𝘦𝘳𝘮𝘢𝘯𝘺, 𝘚𝘸𝘦𝘥𝘦𝘯, 𝘵𝘩𝘦 𝘕𝘦𝘵𝘩𝘦𝘳𝘭𝘢𝘯𝘥𝘴, 𝘢𝘯𝘥 𝘉𝘦𝘭𝘨𝘪𝘶𝘮, 𝘶𝘯𝘥𝘦𝘳 𝘎𝘳𝘢𝘯𝘵 𝘈𝘨𝘳𝘦𝘦𝘮𝘦𝘯𝘵 𝘕𝘰. 101139842.

𝘉𝘌𝘠𝘖𝘕𝘋5 𝘱𝘳𝘰𝘫𝘦𝘤𝘵 𝘪𝘴 𝘴𝘶𝘱𝘱𝘰𝘳𝘵𝘦𝘥 𝘣𝘺 𝘵𝘩𝘦 𝘊𝘩𝘪𝘱𝘴 𝘑𝘰𝘪𝘯𝘵 𝘜𝘯𝘥𝘦𝘳𝘵𝘢𝘬𝘪𝘯𝘨 𝘢𝘯𝘥 𝘪𝘵𝘴 𝘮𝘦𝘮𝘣𝘦𝘳𝘴, 𝘪𝘯𝘤𝘭𝘶𝘥𝘪𝘯𝘨 𝘵𝘩𝘦 𝘵𝘰𝘱-𝘶𝘱 𝘧𝘶𝘯𝘥𝘪𝘯𝘨 𝘣𝘺 𝘕𝘢𝘵𝘪𝘰𝘯𝘢𝘭 𝘈𝘶𝘵𝘩𝘰𝘳𝘪𝘵𝘪𝘦𝘴 𝘰𝘧 𝘍𝘳𝘢𝘯𝘤𝘦, 𝘎𝘦𝘳𝘮𝘢𝘯𝘺, 𝘛𝘶𝘳𝘬𝘦𝘺, 𝘚𝘸𝘦𝘥𝘦𝘯, 𝘉𝘦𝘭𝘨𝘪𝘶𝘮, 𝘗𝘰𝘭𝘢𝘯𝘥, 𝘵𝘩𝘦 𝘕𝘦𝘵𝘩𝘦𝘳𝘭𝘢𝘯𝘥𝘴, 𝘐𝘴𝘳𝘢𝘦𝘭, 𝘚𝘸𝘪𝘵𝘻𝘦𝘳𝘭𝘢𝘯𝘥, 𝘢𝘯𝘥 𝘙𝘰𝘮𝘢𝘯𝘪𝘢, 𝘶𝘯𝘥𝘦𝘳 𝘎𝘳𝘢𝘯𝘵 𝘈𝘨𝘳𝘦𝘦𝘮𝘦𝘯𝘵 𝘕𝘰. 876124.

𝘚𝘖𝘐𝘓 𝘌𝘜 𝘱𝘳𝘰𝘫𝘦𝘤𝘵 𝘪𝘴 𝘴𝘶𝘱𝘱𝘰𝘳𝘵𝘦𝘥 𝘣𝘺 𝘵𝘩𝘦 𝘊𝘩𝘪𝘱𝘴 𝘑𝘰𝘪𝘯𝘵 𝘜𝘯𝘥𝘦𝘳𝘵𝘢𝘬𝘪𝘯𝘨 𝘢𝘯𝘥 𝘪𝘵𝘴 𝘮𝘦𝘮𝘣𝘦𝘳𝘴, 𝘪𝘯𝘤𝘭𝘶𝘥𝘪𝘯𝘨 𝘵𝘩𝘦 𝘵𝘰𝘱-𝘶𝘱 𝘧𝘶𝘯𝘥𝘪𝘯𝘨 𝘣𝘺 𝘕𝘢𝘵𝘪𝘰𝘯𝘢𝘭 𝘈𝘶𝘵𝘩𝘰𝘳𝘪𝘵𝘪𝘦𝘴 𝘰𝘧 𝘉𝘦𝘭𝘨𝘪𝘶𝘮, 𝘊𝘻𝘦𝘤𝘩𝘪𝘢, 𝘍𝘳𝘢𝘯𝘤𝘦, 𝘐𝘵𝘢𝘭𝘺, 𝘵𝘩𝘦 𝘕𝘦𝘵𝘩𝘦𝘳𝘭𝘢𝘯𝘥𝘴, 𝘙𝘰𝘮𝘢𝘯𝘪𝘢, 𝘢𝘯𝘥 𝘚𝘸𝘪𝘵𝘻𝘦𝘳𝘭𝘢𝘯𝘥, 𝘶𝘯𝘥𝘦𝘳 𝘎𝘳𝘢𝘯𝘵 𝘈𝘨𝘳𝘦𝘦𝘮𝘦𝘯𝘵 𝘕𝘰. 101139785.