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ACKNOWLEDGMENT: Move2THz is supported by the Chips Joint Undertaking and its members, including the top-up funding by National Authorities of France, Switzerland, Germany, Sweden, the Netherlands, and Belgium, under Grant Agreement n° 101139842.
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Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or the granting authority. Neither the European Union nor the granting authority can be held responsible for them.
Photos © Christophe LEPETIT
Move2THz at the EuCNC & 6G Summit 2026
2-5 June 2026
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The Move2THz project was represented at the EuCNC & 6G Summit 2026, held in Mรกlaga, Spain, from 2โ5 June 2026, where project partners presented their latest research on advanced III-V semiconductor technologies for future high-frequency communication systems. The conference brought together more than 1,000 delegates from over 40 countries, providing an international platform for discussing the latest advances in 5G, 6G, microelectronics, photonics, and beyond.
During the summit, Cristell Maneux (IMS Laboratory, University of Bordeaux) presented a poster entitled:
"๐๐ฉ๐ข๐ณ๐ข๐ค๐ต๐ฆ๐ณ๐ช๐ป๐ข๐ต๐ช๐ฐ๐ฏ ๐ข๐ฏ๐ฅ ๐๐ค๐ข๐ญ๐ข๐ฃ๐ญ๐ฆ ๐๐ฐ๐ฎ๐ฑ๐ข๐ค๐ต ๐๐ฐ๐ฅ๐ฆ๐ญ๐ญ๐ช๐ฏ๐จ ๐ฐ๐ง ๐๐๐-๐ ๐๐๐๐๐ด ๐ถ๐ฑ ๐ต๐ฐ 220 ๐๐๐ป."
The research was carried out through a collaboration between the IMS Laboratory, University of Bordeaux, and III-V Lab, demonstrating the strong partnership between leading European research organisations working on advanced semiconductor devices.
๐๐ฎ๐ญ๐ก๐จ๐ซ๐ฌ:
Valentin Tharyยน
Chhandak Mukherjeeยน
Marina Dengยน
Moussa Cissรฉยน
Nil Davyยฒ
Virginie Nodjiadjimยฒ
Bertrand Ardouinยฒ
Cristell Maneuxยน
ยน IMS Laboratory, University of Bordeaux, CNRS UMR 5218, Bordeaux INP, Talence, France
ยฒ III-V Lab, a joint laboratory between Nokia Bell Labs, Thales and CEA-Leti, Palaiseau, France
The EuCNC & 6G Summit provided an excellent opportunity to present the latest Move2THz research results, exchange knowledge with the international telecommunications and semiconductor research community, and strengthen collaborations that will help shape future 6G and beyond communication technologies.





