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© 2024 by Move2THz Consortium  

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ACKNOWLEDGMENT: Move2THz is supported by the Chips Joint Undertaking and its members, including the top-up funding by National Authorities under Grant Agreement n° 101139842.

Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or the granting authority. Neither the European Union nor the granting authority can be held responsible for them.

Photos © Christophe LEPETIT

Move2THz at the 2025 EuCNC & 6G Summit

3 June, 2025

On 3rd of June, 2025, project coordinator, Francois Brunier (SOITEC), did a presentation at the EuCNC & 6G Summit in Poznań, Poland. Presentation on topic - the next generation of engineered substrates for 6G.

The 2025 EuCNC & 6G Summit builds on putting together two successful conferences in the area of telecommunications: EuCNC (European Conference on Networks and Communications), supported by the European Commission, and the 6G Summit, originated from the 6G Flagship programme in Finland, one of the very first in its area.

Find more information on the event of many photo moments here:
https://www.eucnc.eu/media/photo-gallery/

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