© 2025 by Move2THz Consortium
ACKNOWLEDGMENT: Move2THz is supported by the Chips Joint Undertaking and its members, including the top-up funding by National Authorities of France, Switzerland, Germany, Sweden, the Netherlands, and Belgium, under Grant Agreement n° 101139842.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or the granting authority. Neither the European Union nor the granting authority can be held responsible for them.
Photos © Christophe LEPETIT
Move2THz at IEEE SiPhotonics 2026 in Canada
13 April 2026
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The Move2THz project was represented at the 2026 IEEE Silicon Photonics Conference (SiPhotonics 2026), held on 13–15 April 2026 in Canada.
During the conference, researchers from Eindhoven University of Technology (TU/e) presented the scientific contribution titled: “Analysis of InGaAsP Multi-Quantum Wells Directly Grown on InP-on-Si Wafers for Photonic Integration”
The oral presentation focused on the analysis of InGaAsP multi-quantum well structures directly grown on InP-on-Si wafers, contributing to the advancement of photonic integration technologies and the development of next-generation photonic-electronic systems.
The paper authored by: Jhe-An Lin, Akanksha Kapoor, Marcel Verheijen, Victor Dolores Calzadilla, Kevin Williams, and Yuqing Jiao from TU/e.
Participation in IEEE SiPhotonics 2026 provided an excellent opportunity to disseminate Move2THz research results and engage with the international silicon photonics and integrated photonics research community.
More information about the conference is available here:
https://www.ieee-siphotonics.org/