© 2025 by Move2THz Consortium
ACKNOWLEDGMENT: Move2THz is supported by the Chips Joint Undertaking and its members, including the top-up funding by National Authorities of France, Switzerland, Germany, Sweden, the Netherlands, and Belgium, under Grant Agreement n° 101139842.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or the granting authority. Neither the European Union nor the granting authority can be held responsible for them.
Photos © Christophe LEPETIT
Move2THz at CSW2026 in Japan
24-28 May 2026
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The Move2THz project was proud to contribute to Compound Semiconductor Week (CSW2026), held from 24–28 May 2026 in Kumamoto, Japan. Recognised as one of the world's leading events for compound semiconductor research, CSW2026 brought together scientists, engineers, and industry leaders to present the latest advances in materials, devices, and applications across the semiconductor ecosystem. The conference combines the 52nd International Symposium on Compound Semiconductors (ISCS) and the 37th International Conference on Indium Phosphide and Related Materials (IPRM), providing a unique platform for scientific exchange and collaboration.
As part of the conference programme, Reynald Alcote presented the paper:
"Improved InP HBT Reliability by Strain-Engineered Epitaxy on InPoSi."
Publications Co-authors:
Y. Mols; R. Alcotte; Z. X. Guo; A. Vais; S. Yadav; A. Possberg; M. De Maeyer; P. Swekis; D. Colucci; C. Roda Neve; B. Ghyselen; U. Peralagu; B. Parvais; N. Collaert; R. Langer; B. Kunert.
For more information about Compound Semiconductor Week 2026 (CSW2026), including the complete conference programme, technical sessions, workshops, and presentations, visit the official conference website at https://csw-jpn.org/ or explore the Online Programme and download the Advance Programme available on the conference website.