© 2025 by Move2THz Consortium
ACKNOWLEDGMENT: Move2THz is supported by the Chips Joint Undertaking and its members, including the top-up funding by National Authorities of France, Switzerland, Germany, Sweden, the Netherlands, and Belgium, under Grant Agreement n° 101139842.
โ
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or the granting authority. Neither the European Union nor the granting authority can be held responsible for them.
Photos © Christophe LEPETIT
Move2THz at CS Week 2025, in Canada
27-30 May 2025
.jpg)
Move2THz partner organizations were united at this year ๐๐จ๐ฆ๐ฉ๐จ๐ฎ๐ง๐ ๐๐๐ฆ๐ข๐๐จ๐ง๐๐ฎ๐๐ญ๐จ๐ซ ๐๐๐๐ค 2025, in Banff, Alberta, Canada.
Move2THz project was mentioned during the three partners' presentations:
I. Category ๐๐ฐ๐ฏ-๐๐ข๐ต๐ช๐ท๐ฆ ๐๐๐-๐ ๐๐ฑ๐ช๐ต๐ข๐น๐บ: Claire Besanรงon (III-V Lab, a joint lab of Nokia Bell Labs, Thales Research and Technology, and CEA-Leti) with the presentation titled "III-V integration on Silicon by MOVPE Regrowth on Heterogeneous InPoSi wafer".
II. Category ๐๐ช๐จ๐ฉ-๐๐ฑ๐ฆ๐ฆ๐ฅ ๐๐๐-๐ ๐๐ฆ๐ท๐ช๐ค๐ฆ๐ด: Colombo Bolognesi (ETH Zurich) with the presentation titled "From DC to THz with Type-II InP/GaAsSb DHBTs: A Technology Born in Canada and Matured in Switzerland".
III. Category ๐๐ฆ๐ต๐ฆ๐ณ๐ฐ๐จ๐ฆ๐ฏ๐ฆ๐ฐ๐ถ๐ด ๐๐ฏ๐ต๐ฆ๐จ๐ณ๐ข๐ต๐ช๐ฐ๐ฏ ๐ข๐ฏ๐ฅ ๐๐ฑ๐ต๐ฐ๐ฆ๐ญ๐ฆ๐ค๐ต๐ณ๐ฐ๐ฏ๐ช๐ค๐ด: Nils Weimann (University of Duisburg-Essen) with the presentation titled "Heterogeneous integration of InP mmW- and THz RF chips".
CSW2025 is one of the worldโs leading events dedicated to compound semiconductor science and technology. Weโre excited to connect with researchers, industry leaders, and innovators from around the world!
Explore more about this conference: https://sites.google.com/umich.edu/csw2025/home