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ACKNOWLEDGMENT: Move2THz is supported by the Chips Joint Undertaking and its members, including the top-up funding by National Authorities under Grant Agreement n° 101139842.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or the granting authority. Neither the European Union nor the granting authority can be held responsible for them.
Photos © Christophe LEPETIT
Move2THz at CS Week 2025, in Canada
27-30 May, 2025
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Move2THz partner organizations were united at this year 𝐂𝐨𝐦𝐩𝐨𝐮𝐧𝐝 𝐒𝐞𝐦𝐢𝐜𝐨𝐧𝐝𝐮𝐜𝐭𝐨𝐫 𝐖𝐞𝐞𝐤 2025, in Banff, Alberta, Canada.
Move2THz project was mentioned during the three partners' presentations:
I. Category 𝘕𝘰𝘯-𝘕𝘢𝘵𝘪𝘷𝘦 𝘐𝘐𝘐-𝘝 𝘌𝘱𝘪𝘵𝘢𝘹𝘺: Claire Besançon (III-V Lab, a joint lab of Nokia Bell Labs, Thales Research and Technology, and CEA-Leti) with the presentation titled "III-V integration on Silicon by MOVPE Regrowth on Heterogeneous InPoSi wafer".
II. Category 𝘏𝘪𝘨𝘩-𝘚𝘱𝘦𝘦𝘥 𝘐𝘐𝘐-𝘝 𝘋𝘦𝘷𝘪𝘤𝘦𝘴: Colombo Bolognesi (ETH Zurich) with the presentation titled "From DC to THz with Type-II InP/GaAsSb DHBTs: A Technology Born in Canada and Matured in Switzerland".
III. Category 𝘏𝘦𝘵𝘦𝘳𝘰𝘨𝘦𝘯𝘦𝘰𝘶𝘴 𝘐𝘯𝘵𝘦𝘨𝘳𝘢𝘵𝘪𝘰𝘯 𝘢𝘯𝘥 𝘖𝘱𝘵𝘰𝘦𝘭𝘦𝘤𝘵𝘳𝘰𝘯𝘪𝘤𝘴: Nils Weimann (University of Duisburg-Essen) with the presentation titled "Heterogeneous integration of InP mmW- and THz RF chips".
CSW2025 is one of the world’s leading events dedicated to compound semiconductor science and technology. We’re excited to connect with researchers, industry leaders, and innovators from around the world!
Explore more about this conference: https://sites.google.com/umich.edu/csw2025/home